he Sn35Pb65 tin – lead solder wire and solder bar exhibit extremely stable soldering performance. The alloy composition is 35% tin and 65% lead. The wire diameter ranges from 0.35mm to 3.0mm. The active rosin flux in the solder wire is made using high – tech processes. This type of solder wire belongs to high – temperature lead – tin wire, with a melting point of approximately 220 degrees Celsius and an operating temperature of 250 degrees Celsius.

Our products are made from high – purity metals. Through a vacuum deoxidation process under strict quality control, the degree of oxidation can be effectively controlled, as well as the contents of metals and non – metals.

The Sn35Pb65 tin – lead solder wire and solder bar have a smooth surface, extremely high purity, good fluidity, excellent wettability, and minimal oxidation slag, making them an ideal choice for high – demand manual soldering processes. At soldering temperatures above 300 degrees Celsius, the anti – oxidation solder bar can quickly solidify solder joints and provide a short wetting time. Its expansion rate is higher than that of ordinary solder. Due to its strong anti – oxidation property, the solder joints have a bright luster. Therefore, our products are also suitable for spot – welding of PCB components.