Our Sn30Pb70 tin – lead solder wire and solder bar fall into the category of high – temperature leaded solder products. They have a melting point of 225 °C and a working temperature of 280 °C. The alloy is composed of 30% tin and 70% lead, with diameters ranging from 0.35mm to 3.0mm.
This series of rosin – cored solder wire uses the latest type of activated rosin flux and is produced by the most advanced automated equipment. Thus, it can meet the complex and high – precision development needs of the electronics industry.
The Sn30Pb70 tin – lead solder wire and solder bar feature a uniform surface, extremely high purity, excellent fluidity and wettability, and very little oxidation slag. They are suitable for demanding manual soldering processes.
In addition, the product has strong oxidation resistance, can provide a mirror – like surface, has a short wetting time, and a relatively high expansion rate below 300 °C. Its solder joints are smooth and beautiful, making our product an ideal choice for spot – soldering PCB components.
Features
- With the no – clean activated rosin flux, the solder wire has a high melting speed, excellent wettability and spreadability, thus delivering remarkable soldering results.
- Our Sn30Pb70 tin – lead solder wire and solder bar have excellent electrical conductivity. They produce no odor, spatter, or core breakage. The solder joints are full, firm, and highly reliable.
- The manufactured leaded solder wire has a high melting point.
Chemical Components
| Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
| 30±0.5 | < 0.1 | < 0.08 | Residue Content | < 0.2 | < 0.1 | < 0.001 | < 0.02 | < 0.001 | < 0.03 | < 0.002 |
