Our Sn99Ag0.3Cu0.7 lead – free solder wire and solder bar, also known as SAC0307 high – melting – point lead – free solder, have a composition of 99% tin, 0.3% silver, and 0.7% copper. According to customer requirements, the lead content is usually less than 100 ppm.

The lead – free solder wire produced by yunfang Tin Industry Solder Company has flux as the core material, with an addition amount generally around 2%. The wire diameter can reach above 0.15mm. The material selection process strictly follows the RoHS directive and SS – 00259 standard. All processes from raw material smelting, mixing, inspection to pouring are carried out using high – standard production processes.

Our environmentally friendly lead – free solder uses two different raw materials, including electrolytic lead with a refined lead content of 99.99% and No. 1 tin with a purity exceeding 99.97%. Due to the addition of copper, this Sn99Ag0.3Cu0.7 solder wire can make electronic components generate a relatively high resistivity during the soldering process.

The combination of three different alloy components makes this lead – free environmental – friendly solder wire have a high melting point, be not easy to soften, and greatly enhance its anti – oxidation ability.

The active flux in this product can provide superior soldering assistance.

Chemical Components
Sn	Ag	Cu	Pb	Sb	Bi	Zn	Fe	Al	As	Cd
Residue Content	0.3±0.1	0.7±0.2	< 0.1	< 0.1	< 0.06	< 0.001	< 0.02	< 0.001	< 0.03	< 0.002

Physical Properties