The soldering flux is designed to effectively facilitate the soldering process. It is a chemical compound that protects the metal surface and prevents oxidation of the metal parts to be welded. The metal surface remains intact both before and after the soldering. This soldering flux is a natural soldering material with resin as its main component. It generates extremely little smoke, so it does not pollute the working environment and does not harm the health of operators.
specification
- Spreading Rate %: 83%
- Halide Content %: 0.008%
- Copper – Mirror Test: Passed
- Electrical Resistance Ω: 5×10¹²Ω
- Solid – State Components %: 1.6±0.4
- Water – Extract Resistivity: 6×10⁴Ω·cm
- Appearance: Light Golden Liquid
- Specific Gravity (25℃): 0.800±0.005
- Boiling Point ℃: 88℃ – 135℃
- Welding Preheating Temperature ℃: 95℃ – 120℃
- Operation Methods: Foaming, Spraying, Dipping
- Tinning Time: 4 – 7 seconds
Application Areas
For the highly stable soldering of electronic components, this soldering flux can meet two strict standards, namely MIL – P – 28810 and IPC – 819. Therefore, it is highly reliable when used in electronic communication devices, computer automation products, computer mainframe systems, computer peripheral interface devices, etc.