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Fluxes & Other Products
Flux is designed to facilitate the soldering process. It is a chemical substance that protects the surface and prevents oxidation on the metals being soldered. The surface remains unchanged before and after the soldering process. Flux is a natural soldering material with rosin as its main component.
Lead Free Solder Wire and Solder Bar
The Sn95Sb5 lead-free solder wire is one of our high-performance flux products. It melts quickly and offers excellent fluidity during soldering. The wire diameter is over 0.3 mm. It’s a typical high-temperature lead-free solder wire with a melting point of about 240°C.
Sn99Ag0.3Cu0.7 lead – free solder wire and solder bar, also known as high – melting – point SAC0307 lead – free solder, contain 99% tin, 0.3% silver, and 0.7% copper. The lead content can generally be controlled below 100ppm according to customers’ requirements.
Sn96.5Ag3.0Cu0.5 flux-cored solder wire and solder bar are commonly used in lead-free soldering. They feature bright solder joints and excellent performance, though at a relatively high cost. Our products of this type have obtained SGS and RoHS certificates, ensuring high quality.
Sn99.3Cu0.7 lead – free solder wire and solder bar, composed of 99.3% tin and 0.7% copper, are suitable for the welding of common metal equipment, copper pipes and copper plates. They are environment – friendly solders using lead – free technology.
Leaded Solder Wire and Solder Bar
Sn25Pb75 tin – lead solder wire and solder bar have a wide range of applications. They are used in electrical products such as thermal fuses, power semiconductors, and calculators. The solder wire is especially suitable for soldering materials like stainless steel, zinc alloys, and aluminum lamp caps. In the automotive and electronics industries, it is commonly applied to the soldering of fans, wires, and automotive printed circuit boards.
Sn35Pb65 tin – lead solder wire and solder bar offer highly stable soldering performance. The alloy contains 35% tin and 65% lead. The solder wire is available in diameters ranging from 0.35mm to 3.0mm. The activated rosin flux in the solder wire is made using high – tech processes.
Our Sn40Pb60 tin – lead solder wire and solder bar have a melting point of around 200 °C and offer stable soldering performance. Our company combines years of production experience with cutting – edge technologies. We’ve introduced German direct – reading spectrometers to strictly control quality and use high – purity tin alloys as raw materials to ensure product quality.
Sn45Pb55 tin – lead solder wire and solder bar have a melting point of around 215 °C and a working temperature of 250 °C. Their alloy contains 45% tin and 55% lead. Using an appropriate amount of flux during application can achieve excellent soldering results.
Our Sn50Pb50 solid tin – lead solder wire and solder bar feature reliable performance. They have a melting point of approximately 200 degrees Celsius and a working temperature of 250 degrees Celsius. The Sn50Pb50 indicates that the alloy used in this solder wire and solder bar contains 50% tin and 50% lead respectively.
Our Sn60Pb40 water – soluble tin – lead solder wire and solder bar are popular and highly demanded products. Boasting a melting point of 189 degrees Celsius, they deliver remarkably stable soldering performance. The Sn60Pb40 composition indicates that the alloy in both the solder wire and bar consists of 60% tin and 40% lead.
The Sn63Pb37 no – clean tin – lead solder wire and solder bar are highly versatile. They are suitable for high – precision electronics, where pinpoint soldering is crucial. They also serve well in the soldering of common electronic products. Additionally, they are an excellent choice for the automotive and electronics industries, ensuring reliable connections in a wide range of manufactured goods.
Solder Paste (Syringe Packing and Bottle Packing)
The Sn64Bi35Ag1 medium-temperature lead-free solder paste indicates that the alloy consists of 64% tin, 35% bismuth, and 1% silver. Its operating temperature can be divided into a preheating temperature ranging from 110°C to 160°C, and the melting point is 189°C.
Our Sn42Bi58 for LED is a typical low – temperature lead – free solder paste. Its alloy consists of 42% tin and 58% bismuth. The operating temperature is divided as follows: preheating temperature ranges from 90°C to 110°C, the melting point is 138°C, and the reflow soldering temperature ranges from 150°C to 100°C.
Our Sn96.5Ag3.0Cu0.5 (SAC305) lead – free silver solder paste is made from an alloy formed by 96.5% tin, 3% silver, and 0.5% copper. This product is suitable for relatively high – requirement reflow soldering processes. Its operating temperature can be divided into three types.
The Sn99Ag0.3Cu0.7 high – temperature SMT lead – free solder paste adopts an alloy composed of 99% tin, 0.3% silver, and 0.7% copper. With a melting point of 227 °C, it is suitable for relatively high – requirement reflow soldering processes.