The Sn42Bi58 low – temperature lead – free solder paste is an alloy with a tin content of 42% and a bismuth content of 58%. Its working temperature is divided as follows: the preheat temperature ranges from 80 degrees Celsius to 120 degrees Celsius, the melting point is 138 degrees Celsius, and the reflow temperature ranges from 160 degrees Celsius to 140 degrees Celsius. This product is suitable for reflow soldering processes with rather strict temperature requirements.
Moreover, due to the unique proportion of the alloy components, this solder paste has excellent fluidity and outstanding soldering effects. It is especially suitable for soldering heat – sensitive components and fine circuit boards.
Applications
Our Sn42Bi58 low – temperature lead – free solder paste can be used for precision sensor circuit boards, small – sized electronic device motherboards, wearable device circuit boards, smartwatch motherboards, printed circuit boards, surface – mount technology, and various high – precision and temperature – sensitive circuit boards.
Technical Parameters
| Heating Rate | Time to Reach 80ºC | Constant Temperature 80 – 110℃ | Peak Temperature | Cooling Rate | |
|---|---|---|---|---|---|
| 1 – 2 °C/s | < 40 – 60 s | 40 – 80 s | 160 ± 5°C | 20 – 40 s | < 3°C/min |
Storage, Operation and Shelf Life
After customers receive the Sn42Bi58 low – temperature lead – free solder paste, the best way is to store it in the refrigerator. We recommend that the solder paste be refrigerated at a temperature between 0 degrees Celsius and 5 degrees Celsius. The shelf life is 8 months from the production date. In addition, the goods should follow the first – in – first – out principle.
Before use, the solder paste needs to be placed at room temperature. The recommended time is 3 hours. After the temperature returns to normal, the storage period is 36 hours. Once the Sn42Bi58 low – temperature lead – free solder paste is opened, the storage period is 8 hours. Before the reflow soldering process starts, it takes 80 ± 20 minutes for the solder paste to stay on the printed circuit board.
It is strictly prohibited to mix the remaining solder paste with new solder paste in the same bottle.
Before use, the solder paste needs to be placed at room temperature. The recommended time is 3 hours. After the temperature returns to normal, the storage period is 36 hours. Once the Sn42Bi58 low – temperature lead – free solder paste is opened, the storage period is 8 hours. Before the reflow soldering process starts, it takes 80 ± 20 minutes for the solder paste to stay on the printed circuit board.
It is strictly prohibited to mix the remaining solder paste with new solder paste in the same bottle.
Technical Data Sheet
| Type | Chemical Composition (Weight %) | |||||
|---|---|---|---|---|---|---|
| Tin | Bismuth | Lead | Iron | Aluminum | Cadmium | |
| Tin 42 – Bismuth 58 | 42 ± 0.5 | 58 ± 0.5 | < 0.01 | < 0.02 | < 0.001 | < 0.002 |
Yunfang Solder Co., Ltd. is dedicated to the R & D, production, and sales of solder products and has accumulated over a decade of rich experience in the soldering field. The company mainly supplies various solder wires, solder bars, solder pastes, solder powders, fluxes, soldering machines, etc.
The products are widely used in many fields such as communication, electrical appliances, electronic instruments, and meters. The company has passed the ISO9001:2000 and ISO9001:2008 quality system certifications, and many of its environmentally friendly products have passed a number of authoritative certifications such as SGS and RoHS.
The products are widely used in many fields such as communication, electrical appliances, electronic instruments, and meters. The company has passed the ISO9001:2000 and ISO9001:2008 quality system certifications, and many of its environmentally friendly products have passed a number of authoritative certifications such as SGS and RoHS.
