Sn55Pb45 Lead – containing Solder Wire and Solder Bar

Product Features

1. Stable Soldering Performance: The Sn55Pb45 lead – containing solder wire and solder bar exhibit stable soldering performance. The alloy is composed of 55% tin and 45% lead, with a melting point of approximately 200°C and a working temperature of 250°C.
2. Complete Product Specifications: The solder wire is available in a wide range of diameters, from 0.35mm to 3.0mm. A 0.35mm diameter is suitable for soldering tiny components, such as the pins of mobile phone chips. A 3.0mm diameter is ideal for components with larger solder joints, like the wiring connections in power equipment.
3. High – tech Activated Flux: The solder wire uses a high – tech activated flux. This no – clean activated rosin flux melts rapidly, allowing for quick entry into the soldering state and improving efficiency. It has excellent wettability, spreading quickly on the soldering surface, and good expandability, resulting in full and firm solder joints and excellent soldering effects.
4. Excellent Electrical Conductivity: This product has excellent electrical conductivity, ensuring stable current transmission without core breakage. Composed of tin and lead, it has a high melting point, stable high – temperature soldering performance, good flexibility, convenient operation, shiny solder joints, fast soldering speed, and no residue.

Outstanding Characteristics

1. Strong Fatigue Resistance and Good Solderability: The solder joints are fatigue – resistant. They are not prone to de – soldering under vibration and temperature changes, and the soldering process is smooth.
2. High – Efficiency Soldering: The flux melts quickly and has good wettability and expandability, improving soldering quality and efficiency.
3. Excellent Electrical Performance: It has good electrical conductivity and no wire core breakage, ensuring the stable operation of electronic products.
4. Comprehensive Advantages: With a high melting point, good softness, fast soldering speed, and no residue, it is suitable for complex soldering scenarios.

Application Scope

1. Manual Soldering: Suitable for professional maintenance personnel and electronics enthusiasts for fine soldering.
2. Component Installation: Capable of accurately connecting various electronic components to circuit boards.
3. Solder Joint Repair: Can quickly repair problems such as virtual soldering and de – soldering of solder joints.
4. Dip Soldering Process: The flux is uniform with few residues, making it suitable for large – scale electronic production.