Sn60Pb40 Water – Soluble Tin – Lead Solder Wire/Solder Bar – An Economical and Efficient Soldering Solution
Product Overview
The Sn60Pb40 tin – lead solder (60% tin, 40% lead) is a classic alloy material in the field of electronic soldering. It has a stable melting point (189°C) and excellent process performance, and is widely used in scenarios such as manual soldering, precision electronic assembly, and industrial maintenance. This product is produced using high – purity electrolytic tin and lead from Yunnan, complies with the ISO quality management system certification, has small composition deviations, and good quality consistency.
Main Specifications
- Alloy Ratio: Sn60% (tin)/Pb40% (lead)
- Diameter Range: 0.35mm – 3.0mm (customizable)
- Melting Point: 189°C | Recommended Operating Temperature: 230°C ±10°C
- Flux Type: Water – soluble, no – clean formula (low residue, non – corrosive)
Certifications and Material Advantages
- Obtained ISO 9001 certification, and the entire production process is fully traceable.
- Raw Materials: Grade – one high – purity electrolytic tin (≥99.9%) and refined lead from Yunnan, with impurity content <0.005%.
- Core Uniformity: ±0.02mm, no wire breakage or hollow core phenomenon.
Applications
- Electronics Manufacturing: PCB component soldering, SMT rework, cable terminal sealing.
- Home Appliances/Automotive: Circuit board repair, sensor soldering, wire harness processing.
- Industrial Uses: Electrical contact soldering, low – temperature metal connection.
Core Advantages
- Efficient Soldering
- Fast melting speed, good fluidity, wetting angle ≤ 35°, suitable for precision soldering.
- The flux has stable activity, with a 50% reduction in spatter rate, and the solder joints are bright and smooth.
- Cost – Effectiveness
- Reduces solder consumption per solder joint by 30%, maximizing the yield of solder joints per unit weight.
- Operates at low temperatures (40 – 60°C lower than lead – free alternatives), saving energy.
- Process Compatibility
- Compatible with manual soldering irons, wave soldering, and selective soldering systems.
- Post – soldering residues can be removed with water – based cleaners, meeting military – grade cleanliness standards.
- Reliability Assurance
- Electrical conductivity ≥ 12.5%IACS, contact resistance < 0.1mΩ.
- Solder joint tensile strength ≥ 45MPa, passed thermal cycle testing from – 40°C to 125°C.
