The Sn63Pb37 for PCB is a well – known mid – temperature tin – lead solder paste. Its alloy composition consists of 63% tin and 37% lead. The working temperature is divided into a pre – heat temperature ranging from 100℃ to 140℃, a melting point of 183℃, and a reflow temperature ranging from 200℃ to 110℃. This product is highly suitable for the reflow soldering process with high requirements.
As one of the lead – containing solder pastes in our product line, the Sn63Pb37 solder paste can provide excellent soldering results. It has been exported to countries such as Brazil and South Korea, and we are actively seeking global agents to expand our market.
Application Areas
The Sn63Pb37 mid – temperature lead – containing solder paste is applicable to a wide range of scenarios. It can be used for LED circuit boards, various lighting devices, computer motherboards, mobile phone motherboards, printed circuit boards, surface – mount technology components, and all high – precision circuit boards where reliable soldering is crucial.
Product Features
- Excellent Fluidity and Soldering Effect
Our product has outstanding fluidity, enabling precise pad printing. The minimum distance between pads can reach 0.3 mm, ensuring high – quality soldering connections. - Stable Viscosity
During continuous printing, the viscosity changes minimally. Even after the stencil has been in operation for 10 hours, the viscosity remains stable, and the product can still maintain a good and continuous printing effect. - Shape Retention
After several hours of the printing process, the solder paste can maintain its original shape. This ensures that the surface – mount assembly process is not affected, contributing to consistent and reliable soldering results. - Good Wettability
The Sn63Pb37 mid – temperature tin – lead solder paste for PCB shows excellent wettability on substrates made of different materials. This property helps to form firm and reliable connections, improving the overall performance of soldered joints. - No Solder Beads Generation
Due to its excellent soldering performance, this product does not generate any tiny solder beads after the soldering process is completed. This makes it very suitable for applications with high requirements for the cleanliness of the soldering surface and the absence of solder beads.
Technical Data Sheet
- Specification Parameters
- Specification: Sn63Pb37
- Appearance: Gray – black paste
- Weight: 500 grams/bottle, 10 kilograms/box
- Melting Point (℃): 183
- Specific Gravity (g/cm³): 8.62
- Tensile Strength (MPa): 52.1
- Chemical Components
Type Chemical Composition (wt. %) Sn Pb Sb Cu Bi Zn Fe Al Cd Sn63Pb37 63±0.5 Residue Content < 0.2 < 0.08 < 0.1 < 0.001 < 0.02 < 0.001 < 0.002
Storage Method
The Sn63Pb37 mid – temperature tin – lead solder paste for PCB is best stored in the temperature range of 2℃ to 8℃. The shelf life of unopened products is 8 months. Direct sunlight should be avoided to maintain its quality and performance.
Dongguan Yunfang Metal Co., Ltd. has been committed to the R & D, production, and sales of solder products for more than a decade since its establishment. Our main products include various solder wires, solder bars, solder pastes, solder powders, and fluxes. These products are widely used in fields such as communication, electrical appliances, electronic instruments, and meters. Our company has obtained ISO9001:2000 and ISO9001:2008 certifications, and many of our environmentally friendly products have also passed relevant certifications such as SGS and RoHS.
