Sn63Pb37 lead – tin solder wire and solder bar with no – clean flux is truly a “versatile player” in the field of soldering. Thanks to its outstanding performance, it is widely used in the manufacturing of high – precision electronic products. For example, in the soldering of high – end smartphone chips and precision computer motherboards, it can accurately achieve reliable connections of tiny solder joints. It also performs remarkably in the production of ordinary electronic products such as home smart devices and small electrical appliances, ensuring high – efficiency and stable soldering quality. In automotive electronic systems, from the circuit soldering of engine control modules to in – vehicle entertainment devices, and in the production of various products in the electronics industry, it is an essential component. It is especially suitable for the manual fine soldering of printed circuit boards, helping technicians to create high – quality circuit connections.
Product Characteristics
- Excellent Fatigue Resistance and Soldering Performance: The solder joints have excellent fatigue resistance and can withstand long – term vibrations, temperature changes, and other tests. They are not easy to crack or desolder. The soldering process is smooth, and firm connections can be easily achieved, ensuring the long – term stable operation of products.
- High Electrical Conductivity: It has outstanding electrical conductivity, ensuring the efficient transmission of current at the solder joints with low signal loss. It meets the strict requirements for electrical performance in electronic products and provides a solid foundation for the stable operation of equipment.
- Advantages of Medium – Temperature Soldering: It belongs to medium – temperature solder. Its softness is just right, making it easy to operate. It has excellent wettability, and the solder can quickly and evenly cover the soldering area, forming a tight bond, thus improving soldering quality and efficiency.
- Assistance of Active Rosin Flux: An appropriate amount of active rosin flux is added inside, which greatly enhances the soldering effect. During soldering, it can quickly remove the oxides on the soldering surface, accelerate the soldering speed, and the solder has strong fluidity, effectively reducing problems such as virtual soldering and missed soldering.
- Super Oxidation Resistance: Special oxidation – resistant elements are added, endowing the product with super oxidation resistance. Even after long – term storage or in a high – temperature soldering environment, it is not easy to soften or oxidize. It always maintains good soldering performance, extends the service life of the product, and reduces the use cost.
Technical parameters
| Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
| 63±0.5 | < 0.1 | < 0.08 | Residue Content | < 0.1 | < 0.1 | < 0.001 | < 0.02 | <0.005 | < 0.03 | < 0.002 |
