Sn64Bi35Ag1 Medium – Temperature Lead – Free Solder Paste
The Sn64Bi35Ag1 medium – temperature lead – free solder paste is composed of an alloy containing 64% tin, 35% bismuth, and 1% silver. Its operating temperature can be divided as follows: the preheating temperature ranges from 115°C to 155°C, the melting point is 189°C, and the reflow temperature ranges from 205°C to 255°C. It is highly suitable for relatively strict reflow soldering processes.
The unique combination of 1% silver and active bismuth in its composition makes this solder paste applicable to both low – temperature and medium – temperature electrical devices. Due to its excellent wettability and soldering performance, the Sn64Bi35Ag1 medium – temperature lead – free solder paste is especially suitable for circuit board soldering.
Application Areas
Our company’s Sn64Bi35Ag1 medium – temperature lead – free solder paste can be widely applied to LED circuit boards, various lighting fixtures, computer motherboards, mobile phone motherboards, printed circuit boards, surface – mount technology applications, and various high – precision circuit boards.
Technical Parameters
| Heating Rate | Time to Reach 115ºC | Constant Temperature at 115 – 138℃ | Peak Temperature | Cooling Rate |
|---|---|---|---|---|
| 1 – 3 °C/s | < 50 – 80 s | 50 – 90 s | 205±10°C | < 4°C/s within 25 – 55 s |
Storage, Operation and Shelf Life
Once customers receive the Sn64Bi35Ag1 medium – temperature lead – free solder paste, it is recommended to store it in the refrigerator. We suggest refrigerating the solder paste within the temperature range of 3°C to 7°C. The shelf life is 7 months from the production date. In addition, our products should follow the first – in – first – out principle.
Before use, the solder paste should be left at room temperature. The recommended time is 5 hours. After the temperature returns to normal, the shelf life is 50 hours. Once the Sn64Bi35Ag1 medium – temperature lead – free solder paste is opened, the shelf life is 14 hours. Before the start of the reflow soldering process, the solder paste needs to stay on the printed circuit board for 90±20 minutes.
It is strictly prohibited to mix the remaining solder paste with new solder paste in the same bottle.
Before use, the solder paste should be left at room temperature. The recommended time is 5 hours. After the temperature returns to normal, the shelf life is 50 hours. Once the Sn64Bi35Ag1 medium – temperature lead – free solder paste is opened, the shelf life is 14 hours. Before the start of the reflow soldering process, the solder paste needs to stay on the printed circuit board for 90±20 minutes.
It is strictly prohibited to mix the remaining solder paste with new solder paste in the same bottle.
Technical Data Sheet
| Type | Chemical Composition (Weight Percentage) | ||||||
|---|---|---|---|---|---|---|---|
| Tin (Sn) | Bismuth (Bi) | Silver (Ag) | Lead (Pb) | Iron (Fe) | Aluminum (Al) | Cadmium (Cd) | |
| Tin64 – Bismuth35 – Silver1 | 64±0.5 | 35±0.5 | 1±0.5 | < 0.01 | < 0.02 | < 0.001 | < 0.002 |
Yunfang Metal Products Co., Ltd. has been committed to the research, development, production and sales of solder products. With more than a decade of experience in the welding industry, it mainly supplies various solder wires, solder bars, solder pastes, solder powders, fluxes, soldering machines, etc.
Its products are widely used in fields such as communication, electrical appliances, electronic instruments, and meters. The company has obtained ISO9001:2000 and ISO9001:2008 certifications, and a number of environmentally friendly products have passed relevant certifications such as SGS and RoHS.
Its products are widely used in fields such as communication, electrical appliances, electronic instruments, and meters. The company has obtained ISO9001:2000 and ISO9001:2008 certifications, and a number of environmentally friendly products have passed relevant certifications such as SGS and RoHS.
