Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste utilizes an alloy composed of 96.5% tin, 3% silver, and 0.5% copper. This product is highly suitable for the reflow soldering process with relatively strict requirements. Its working temperature can be classified into three categories. The pre – heat temperature ranges from 135 degrees Celsius to 165 degrees Celsius. The melting temperature is 218 degrees Celsius, and the reflow temperature spans from 255 degrees Celsius to 245 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has successfully passed the SGS inspection and obtained multiple certifications, such as RoHS, REACH, etc. Our lead – free solder cream has been shipped to the United States, Japan, and France. Additionally, we are seeking agents worldwide. If you are interested in our product, please get in touch with us.
Chemical Component Data Sheet
| Type | Chemical Composition (wt. %) | |||||||
|---|---|---|---|---|---|---|---|---|
| Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
| Sn96.5Ag3.0Cu0.5 | Bal | < 0.1 | < 0.1 | 0.5±0.2 | 3.0±0.2 | < 0.02 | < 0.001 | < 0.002 |
Physical Properties
| Type | Melting Point, ℃ | Specific Gravity, g/cm³ | Tensile Strength, MPa |
|---|---|---|---|
| Sn96.5 – Ag3.0 – Cu0.5 | 218 – 220 | 7.42 | 54.1 |
Main Specifications
- Specification: Sn96.5 – Ag3.0 – Cu0.5
- Appearance: Gray – black adhesive paste
- Weight: 500g/bottle, 10kg/box
Storage, Operation and Storage Life
We recommend that the Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste be stored in a cold environment at a temperature between 3 degrees Celsius and 7 degrees Celsius. The warranty period is 7 months from the production date. Our products should follow the First – In – First – Out principle.
Before use, the solder paste should be left at room temperature. The recommended time is 5 hours. After reaching room temperature, the storage life is 50 hours. Once the product is unsealed, the storage life is 14 hours. It takes 110±20 minutes for the solder paste to remain on the printed circuit board before the reflow soldering process starts.
Before use, the solder paste should be left at room temperature. The recommended time is 5 hours. After reaching room temperature, the storage life is 50 hours. Once the product is unsealed, the storage life is 14 hours. It takes 110±20 minutes for the solder paste to remain on the printed circuit board before the reflow soldering process starts.
