The Sn99Ag0.3Cu0.7 high – performance SMT lead – free solder paste makes use of an alloy consisting of 99% tin, 0.3% silver, and 0.7% copper. Boasting a melting point of 227 degrees Celsius, this product is well – suited for the reflow soldering process with rather strict requirements. Its preheat temperature spans from 140 degrees Celsius to 160 degrees Celsius, and the reflow temperature ranges between 270 degrees Celsius and 205 degrees Celsius.
Moreover, the flux incorporated in our Sn99Ag0.3Cu0.7 high – performance SMT lead – free solder paste utilizes a highly reliable low – halogen and low – ion activator. That is to say, even without post – reflow soldering cleaning, our product exhibits extremely high reliability.
This no – clean lead – free solder paste is applicable to electronic PCBs and SMT operations. There is no need to use other chemical agents for cleaning. It can be automatically dispensed onto the circuit board, providing great convenience and being environmentally friendly.
The water – soluble tin paste can be cleaned with board – cleaning water or other simple agents to remove the residue.
Main Specifications
- Specification: Sn99 – Ag0.3Cu0.7
- Appearance: Gray – black adhesive paste
- Weight: 500g/bottle, 10kg/box
Chemical Composition
| Type | Chemical Composition (wt. %) | |||||||
|---|---|---|---|---|---|---|---|---|
| Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
| Sn99Ag0.3Cu0.7 | Bal | < 0.1 | < 0.1 | 0.7±0.2 | 0.3±0.1 | < 0.02 | < 0.001 | < 0.002 |
Applications
Our Sn99Ag0.3Cu0.7 high – performance SMT lead – free solder paste is perfect for use in precision computer motherboards, mobile phone motherboards, printed circuit boards (PCB), as well as a wide range of high – precision electronic circuit boards. It is especially designed for LED applications, SMT processes, electronic mounting technology, and the soldering of through – hole components.
Packing
The Sn99Ag0.3Cu0.7 high – performance SMT lead – free solder paste is available in two packing types: bottle packing and syringe packing. Each bottle contains 500g of solder paste, and each syringe can hold 100g of solder paste.
The packaging material consists of an inner bubble box layer and an outer carton layer to ensure better protection during transportation.
The size of each carton is 352824cm (length * width * height), and the gross weight is 10kg.
The minimum order quantity (MOQ) is 50kg.
We offer OEM services. We can print our customers’ logos, and the specific price is negotiable.
Our monthly production capacity for lead – free solder wire is 80 tons.
The packaging material consists of an inner bubble box layer and an outer carton layer to ensure better protection during transportation.
The size of each carton is 352824cm (length * width * height), and the gross weight is 10kg.
The minimum order quantity (MOQ) is 50kg.
We offer OEM services. We can print our customers’ logos, and the specific price is negotiable.
Our monthly production capacity for lead – free solder wire is 80 tons.
Pricing and Payment Methods
We accept a variety of international price terms, such as EXW, CFR, CIF, FOB, etc.
We support payment methods like T/T, Western Union, cash, and others.
We support payment methods like T/T, Western Union, cash, and others.
